Technology Highlight
Strong Capacity for developing and implementing 5G RF Chips
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01
Wafer Materials
Designing-
Designing proprietary Wafer materials allows WiPAM to develop components
(with ideal thickness and doping levels) - WiPAM’s Wafer structures enable unique configuration
- yielding non-replicable products with optimal performance
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Designing proprietary Wafer materials allows WiPAM to develop components
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02
Semiconductor Fabrication
Process Development-
Partnering with foundries to co-develop device fabrication processes
(transferring its know-how in device designing and process development) - Securing technological leadership through optimization of device properties
- Delivering ideal product performance through proprietary development of devices and fabrication processes
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Partnering with foundries to co-develop device fabrication processes
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03
Designing High-Efficiency Power Amplifier Circuits
- Capacity for designing proprietary high-efficiency power amplifier circuits
- WiPAM’s distinguished circuit-designing capacity ensures the development of components with unrivaled performance
- Size optimization provides superior price competitiveness
